Semiconductor packaging: It is the process form of placing, fixing and sealing the wafer in the integrated circuit chip with the shell to protect the chip and enhance the electric heating performance; The package is the bridge between the internal world of the chip and the external circuit, and the contacts on the chip are connected to the pins of the package housing with wires, and these pins are connected to other electronic components through the wires on the printed board. 

               
       Since its establishment, our company has always focused on the field of integrated circuits to provide customers with more competitive semiconductor packaging products; Through the team's continuous R&D investment, with the team's in-depth understanding of packaging processes such as SOT/SOP/DFN/QFN/DIP; While ensuring product performance, compared with the original packaging form, the product volume is smaller, the packaging cost is lower, and the value space is greater for customers.